Evaluating the barriers to e-waste closed-loop supply chain adoption

Abstract

Purpose

Rapid innovation and developments in personal electronic technology have encouraged users to change users' devices more frequently than ever, which has resulted in creating a massive increase in the amount of electronic waste. The study focuses on identifying the barriers to closed-loop supply chain (CLSC) in the electronic industry.

Design/methodology/approach

A framework for analyzing the relationships among CLSC adoption barriers is designed. The authors adopted the decision-making trial and evaluation laboratory (DEMATEL) technique to determine the critical barriers of electronic CLSC from the opinion of experts in the field.

Findings

The outcome from the analysis suggests that cost barriers, financial barrier, process barriers and supplier-side barriers are the main causal factors that prevent the adoption and implementation of e-waste CLSC. The causal relationship indicates that financial barrier is the most influential factor, while phycological barrier is the most flexible barrier to the adoption of e-waste CLSC.

Research limitations/implications

This study is restricted to CLSC adoption barriers in the electronic industry by evaluating 36 sub-barriers grouped into 8 main dimensions related to different members of the supply chain.

Practical implications

Closed-loop adoption barriers have been proposed to understand the crucial barriers to implementation of CLSC in the electronic industry. The cause-and-effect relationship indicates the critical factors to be improved to increase adoption of e-waste CLSC, helping managers and regulatory bodies to mitigate the problem areas.

Originality/value

This study contributes to the literature on CLSC by adopting a multi-criteria decision-making (MCDM) technique which captures the critical barriers of e-waste CLSC adoption in Indian scenario.

Citation

Pongen, I., Ray, P. and Gupta, R. (2023), "Evaluating the barriers to e-waste closed-loop supply chain adoption", Benchmarking: An International Journal, Vol. ahead-of-print No. ahead-of-print. https://doi.org/10.1108/BIJ-01-2023-0032