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Research of a core-less linear machine with applied Halbach array for low speed application

Nobuyuki Naoe (Department of Electrical and Electronics Engineering, Kanazawa Technical College, Kanazawa, Japan)
Akio Imazawa (Department of Global Information and Management, Kanazawa Technical College, Kanazawa, Japan)

COMPEL - The international journal for computation and mathematics in electrical and electronic engineering

ISSN: 0332-1649

Article publication date: 20 September 2018

Issue publication date: 30 October 2018

85

Abstract

Purpose

This paper aims to present a Halbach magnet array linear machine, without an iron core and the electromotive force (EMF) characteristic results.

Design/methodology/approach

The linear machine was made with mover coils and a permanent magnet stator without an iron core. For an outline design, the analyzed magnetic density results were compared to the Halbach array with a horizontal array using the 3D finite element analysis. The test was carried out on an experimental system using a prototype linear machine. The EMF of the linear machine, with applied Halbach array magnetic circuit, is verified with the experiment.

Findings

The EMF peak value of the Halbach array is larger than the EMF of the horizontal array. Compared to the EMF in the experimental results, the effective value of the Halbach array is 1.69 times greater at an average operation speed of 373 mm/s.

Originality/value

The core-less linear machine has advantages of reduced cogging torque and iron loss because both the stator and the mover do not have an iron core. The stator and rotor will not rust from water. In this paper, it is clear from the basic electrical characteristics that the linear machine, with applied Halbach array, is larger than the EMF of the horizontal array.

Keywords

Citation

Naoe, N. and Imazawa, A. (2018), "Research of a core-less linear machine with applied Halbach array for low speed application", COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, Vol. 37 No. 5, pp. 1795-1804. https://doi.org/10.1108/COMPEL-01-2018-0021

Publisher

:

Emerald Publishing Limited

Copyright © 2018, Emerald Publishing Limited

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