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Calculation of eddy-current probe signal for a 3D defect using global series expansion

Sandor Bilicz (Department of Broadband Infocommunications and Electromagnetic Theory, Budapest University of Technology and Economics, Budapest, Hungary)
Jozsef Pavo (Department of Broadband Infocommunications and Electromagnetic Theory, Budapest University of Technology and Economics, Budapest, Hungary)
Szabolcs Gyimothy (Department of Broadband Infocommunications and Electromagnetic Theory, Budapest University of Technology and Economics, Budapest, Hungary)
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Abstract

Purpose

The purpose of this paper is to present a novel eddy-current modeling technique of volumetric defects embedded in conducting plates. This problem is of great interest in electromagnetic non-destructive evaluation and has already been exhaustively studied.

Design/methodology/approach

The defect is modeled by a volumetric current dipole density which satisfies an integral equation. The latter is solved by the classical method of moments. The authors propose the use of globally defined, continuous basis functions for the expansion of the current dipole density.

Findings

The proposed global expansion provides an improvement of the numerical stability and the performance of the simulation, over classical approaches. The proposed method is tested against both measured and synthetic data obtained by a different defect model.

Originality/value

The new discretisation scheme – in contrast to the classical approaches – does not need the discretisation of the defect volume. This involves numerous advantages that are discussed in the paper.

Keywords

Acknowledgements

This research is supported by the Hungarian Science Research Fund (OTKA grant no. K105996).

Citation

Bilicz, S., Pavo, J. and Gyimothy, S. (2013), "Calculation of eddy-current probe signal for a 3D defect using global series expansion", COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, Vol. 32 No. 5, pp. 1512-1524. https://doi.org/10.1108/COMPEL-03-2013-0104

Publisher

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Emerald Group Publishing Limited

Copyright © 2013, Emerald Group Publishing Limited

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