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Pre-curing investigation of filling conductive paste in prepreg to interconnect two multilayer structures of backboard for press-fit application

Shouxu Wang (State Key Laboratory of Electronic Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China)
Ting Yang (State Key Laboratory of Electronic Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China)
Yuanming Chen (State Key Laboratory of Electronic Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China)
Wei He (State Key Laboratory of Electronic Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China and Research and Development Department, Guanghua Sci-Tech Co., Ltd., Shantou, China)
Yongsuan Hu (Zhuhai Founder PCB Development Co., Ltd, Zhuhai, China)
Xinhong Su (Zhuhai Founder PCB Development Co., Ltd, Zhuhai, China)

Circuit World

ISSN: 0305-6120

Article publication date: 1 August 2016

135

Abstract

Purpose

The purpose of this paper is to form high density interconnection (HDI) of backboard for press-fit applications with the pre-curing conditions of conductive paste. The best condition of pre-curing conductive paste should be found to obtain good electrical and physical performance of the conductive paste and avoid the simultaneous curing behavior of prepreg.

Design/methodology/approach

A novel structure of backboard was designed by using the connection of conductive paste-filled through holes to connect two multilayers. Pre-curing conditions of conductive paste were investigated to find their effects on resistance, bond strength and volume shrinkage. The reliability of pre-curing conductive paste was also analyzed.

Findings

Pre-curing conditions led to a great influence on the resistance, bond strength and volume shrinkage of the conductive paste. The best condition of pre-curing conductive paste was chosen as the low curing temperature of 60°C and a curing time of 30 min. Cured conductive paste exhibited square resistance of 4.205 mΩ/□ and bonding strength of 22.86 N. The as-obtained pre-curing condition could improve the reliability of conductive paste. Pre-curing process of conductive paste at extremely low temperature to interconnect two multilayer structures improved the density interconnection of backboard for press-fit applications.

Originality/value

The use of HDI of backboard could lead to good assembly for high-speed signal transmission of electronic products with press-fitting components. The connection of pre-curing conductive paste for multilayers could have important function for improving the application for communication backboard.

Keywords

Acknowledgements

The authors gratefully acknowledge the support of Guangdong Innovative Research Team Program (No. 201301C0105324342) and National Natural Science Foundation of China (No. 61474019). The authors also express their sincere thanks for the support of Key Project of Science and Technology Planning of the Guangdong Province, China (No. 2013A090100005).

Citation

Wang, S., Yang, T., Chen, Y., He, W., Hu, Y. and Su, X. (2016), "Pre-curing investigation of filling conductive paste in prepreg to interconnect two multilayer structures of backboard for press-fit application", Circuit World, Vol. 42 No. 3, pp. 104-109. https://doi.org/10.1108/CW-06-2015-0027

Publisher

:

Emerald Group Publishing Limited

Copyright © 2016, Emerald Group Publishing Limited

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