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A modified model of conductor roughness for manufacturing copper lines of printedcircuit board

Chong Wang (School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu, China)
Yingjie Wang (School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu, China)
Kegu Adi (School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu, China)
Yunzhong Huang (School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu, China)
Yuanming Chen (School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu, China)
Shouxu Wang (School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu, China)
Wei He (Zhuhai Founder Sci-Tech High-density Electronics Co., Ltd and Zhuhai Founder Sci-Tech Multilayer Circuit Board Co., Ltd, Zhuhai, China)
Yao Tang (Zhuhai Founder Sci-Tech High-density Electronics Co., Ltd and Zhuhai Founder Sci-Tech Multilayer Circuit Board Co., Ltd, Zhuhai, China)
Yukai Sun (Zhuhai Founder Sci-Tech High-density Electronics Co., Ltd and Zhuhai Founder Sci-Tech Multilayer Circuit Board Co., Ltd, Zhuhai, China)
Weihua Zhang (Zhuhai Founder Sci-Tech High-density Electronics Co., Ltd and Zhuhai Founder Sci-Tech Multilayer Circuit Board Co., Ltd, Zhuhai, China)
Chenggang Xu (College of Chemistry and Materials Science, Sichuan Normal University, Chengdu, China)
Xuemei He (College of Chemistry and Materials Science, Sichuan Normal University, Chengdu, China)

Circuit World

ISSN: 0305-6120

Article publication date: 12 August 2021

Issue publication date: 24 November 2022

168

Abstract

Purpose

The purpose of this paper is to establish an accurate model to quantify the effect of conductor roughness on insertion loss (IL) and provide improved measurements and suggestions for manufacturing good conductive copper lines of printed circuit board.

Design/methodology/approach

To practically investigates the modified model of conductor roughness, three different kinds of alternate oxidation treatments were used to provide transmission lines with different roughness. The IL results were measured by a vector net analyzer for comparisons with the modified model results.

Findings

An accurate model, with only a 1.8% deviation on average from the measured values, is established. Compared with other models, the modified model is more reliable in industrial manufacturing.

Originality/value

This paper introduces the influence of tiny roughness structures on IL. Besides, this paper discusses the effect of current distribution on IL.

Keywords

Acknowledgements

The authors gratefully acknowledge the support of the National Natural Science Foundation of China (Nos 51801018 and 61974020). This work is also supported by the Innovation Team Project of Zhuhai City (No. ZH0405190005PWC) and the projects of Sci and Tech planning of Guangdong Province (No. 2019B090910003) and Zhuhai City (No. ZH01084702180040HJL).

Citation

Wang, C., Wang, Y., Adi, K., Huang, Y., Chen, Y., Wang, S., He, W., Tang, Y., Sun, Y., Zhang, W., Xu, C. and He, X. (2022), "A modified model of conductor roughness for manufacturing copper lines of printedcircuit board", Circuit World, Vol. 48 No. 4, pp. 493-501. https://doi.org/10.1108/CW-10-2019-0144

Publisher

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Emerald Publishing Limited

Copyright © 2021, Emerald Publishing Limited

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