Improvement of plating uniformity for copper patterns of IC substrate with multi-physics coupling simulation
ISSN: 0305-6120
Article publication date: 10 July 2018
Issue publication date: 16 July 2018
Abstract
Purpose
Optimized plating conditions, included proper designs of insulating shield (IS), auxiliary cathode (AC) and different patterns, contribute to the uniformity enhancement of copper deposition.
Design/methodology/approach
Plating experiments were implemented in vertical continuous plating (VCP) line for manufacturing in different conditions. Multiphysics coupling simulation was brought to investigate and predict the plating uniformity improvement of copper pattern. In addition, the numerical model was based on VCP to approach the practical application.
Findings
With disproportionate current distribution, different plating pattern design formed diverse copper thickness distribution (CTD). IS and AC improved plating uniformity of copper pattern because of current redistribution. Moreover, optimized plating condition for effectively depositing more uniformed plating copper layer in varied pattern designs were derived by simulation and verified by plating experiment.
Originality/value
The comparison between experiment and simulation revealed that multiphysics coupling is an efficient, reliable and of course environment-friendly tool to perform research on the uniformity of pattern plating in manufacturing.
Keywords
Acknowledgements
The authors gratefully acknowledge the support of the projects of National Natural Science Foundation of China (No.61474019 and No.61604034), and the authors also express their sincere thanks to project of science and technology planning of Guangdong Province China (No.2015B010127012).
Citation
Xiang, J., Chen, Y., Wang, S., Wang, C., He, W., Zhang, H., Jin, X., Chen, Q. and Su, X. (2018), "Improvement of plating uniformity for copper patterns of IC substrate with multi-physics coupling simulation", Circuit World, Vol. 44 No. 3, pp. 150-160. https://doi.org/10.1108/CW-12-2017-0078
Publisher
:Emerald Publishing Limited
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