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A monopole polarisation diversity antenna for high density packaging MIMO applications

Dhanalakshmi K.M. (Department of Electronics and Communication Engineering, SA Engineering College, Chennai, India)
Kavya G. (Department of Electronics and Communication Engineering, SA Engineering College, Chennai, India)
Rajkumar S. (HCL Technologies Ltd, Chennai, India)

Microelectronics International

ISSN: 1356-5362

Article publication date: 27 January 2023

Issue publication date: 20 February 2024

60

Abstract

Purpose

This paper aims to propose a single element, dual feed, polarisation diversity antenna. The proposed antenna operates from 2.9 to 10.6 GHz for covering the entire ultra-wideband (UWB) frequency range. The antenna is designed for usage in massive multiple input multiple output (MIMO) and closed packaging applications.

Design/methodology/approach

The size of the antenna is 24 × 24 × 1.6 mm3. The radiating element of the antenna is derived from the Sierpinski–Knopp (SK) fractal geometry for miniaturization of the antenna size. The antenna has a single reflecting stub placed between the two orthogonal feeds, to improve isolation.

Findings

The proposed antenna system exhibits S11 < −10 dB, S21 < −15 dB and stable radiation characteristics in the entire operating region. It also offers an envelope correlation coefficient < 0.01, a diversity gain > 9.9 dB and a capacity loss < 0.4 bps/Hz. The simulated and measured outputs were compared and results were found to be in similarity.

Originality/value

The proposed UWB-MIMO antenna has significant size reduction through usage of SK fractal geometry for radiating element. The antenna uses a single radiating element with dual feed. The stub is between the antenna elements which provide a compact and miniaturized MIMO solution for high density packaging applications. The UWB-MIMO antenna provides an isolation better than −20 dB in the entire UWB operating band.

Keywords

Citation

K.M., D., G., K. and S., R. (2024), "A monopole polarisation diversity antenna for high density packaging MIMO applications", Microelectronics International, Vol. 41 No. 2, pp. 75-81. https://doi.org/10.1108/MI-07-2022-0127

Publisher

:

Emerald Publishing Limited

Copyright © 2023, Emerald Publishing Limited

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