IC solder joint inspection based on the Gaussian mixture model
Abstract
Purpose
This paper aims to inspect solder joint defects of integrated circuit (IC) components on printed circuit boards. Here, an IC solder joint inspection algorithm is developed based on a Gaussian mixture model (GMM).
Design/methodology/approach
First, the authors train a GMM using numerous qualified IC solder joints. Then, the authors compare the IC solder joint images with the trained model to inspect the potential defects. Finally, the authors introduce a frequency map and define a metric termed as normalized defect degree to evaluate qualities of the tested IC solder joints.
Findings
Experimental results indicate that the proposed method is superior to the state-of-the-art methods on IC solder joint inspection.
Originality/value
The approach is a promising method for IC solder joint inspection, which is quite different from the traditional classifier-based methods.
Keywords
Acknowledgements
This work was supported in part by the National Natural Science Foundation of China (Grant Nos. 61001179 and 61571139), Guangdong Science and Technology Plan (Grant Nos. 2015B010104006, 2015B010124001 and 2015B090903017).
Citation
Cai, N., Ye, Q., Liu, G., Wang, H. and Yang, Z. (2016), "IC solder joint inspection based on the Gaussian mixture model", Soldering & Surface Mount Technology, Vol. 28 No. 4, pp. 207-214. https://doi.org/10.1108/SSMT-03-2016-0005
Publisher
:Emerald Group Publishing Limited
Copyright © 2016, Emerald Group Publishing Limited