Interfacial behavior and mechanism of brazed diamond with CeO2-added Ni-Cr filler alloy: a combined first-principles and experimental study
Soldering & Surface Mount Technology
ISSN: 0954-0911
Article publication date: 27 June 2023
Issue publication date: 13 November 2023
Abstract
Purpose
This paper aims to investigate the effect and mechanism of O atom single doping, Ce and O atoms co-doping on the interfacial microscopic behavior of brazed Ni-Cr/diamond.
Design/methodology/approach
Using first-principles calculations, the embedding energy, work of separation, interfacial energy and electronic structures of Ni-Cr-O/diamond and Ni-Cr-O-Ce/diamond interface models were calculated. Then, the effect of Ce and O co-doping was experimentally verified through brazed diamond with CeO2-added Ni-Cr filler alloy.
Findings
The results show that O single-doping reduces the interfacial bonding strength between Ni-Cr filler alloy and diamond but enhances its interfacial stability to some extent. However, the Ce and O co-doping simultaneously enhances the interfacial bonding strength and stability between Ni-Cr filler alloy and diamond. The in-situ formed Ce-O oxide at interface impedes the direct contact between diamond and Ni-Cr filler alloy, which weakens the catalytic effect of Ni element on diamond graphitization. It is experimentally found that the fine rod-shaped Cr3C2 and Cr7C3 carbides are generated on diamond surface brazed with CeO2-added Ni-Cr filler alloy. After grinding, the brazed diamond grits, brazed with CeO2-added Ni-Cr filler alloy, present few fracture and the percentage of intact diamond reaches 67.8%. Compared to pure Ni-Cr filler alloy, the brazed diamond with CeO2-added Ni-Cr filler alloy exhibit the better wear resistance and the slighter thermal damage.
Originality/value
Using first-principles calculations, the effect of Ce and O atoms co-doping on the brazed diamond with Ni-Cr filler alloy is investigated, and the calculation results are verified experimentally. Through the first-principles calculations, the interface behavior and reaction mechanism between diamond and filler alloy can be well disclosed, and the composition of filler alloy can be optimized, which will be beneficial for synergistically realizing the enhanced interface bonding and reduced thermal damage of brazed diamond.
Keywords
Acknowledgements
This work was supported by the Natural Science Foundation of Hunan Province of China (No. 2023JJ30046), the Research and innovation project of graduate students in Hunan province (No. CX20220902) and the Research and Innovation Project of Graduate Students in Changsha University of Science and Technology (No. CLSJCX22058).
Conflict of interests: The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.
Ethical approval: There are no experiments involving human tissue.
Citation
Zhang, A., Zhang, J., Zhang, M., Liu, J. and Peng, P. (2023), "Interfacial behavior and mechanism of brazed diamond with CeO2-added Ni-Cr filler alloy: a combined first-principles and experimental study", Soldering & Surface Mount Technology, Vol. 35 No. 5, pp. 265-274. https://doi.org/10.1108/SSMT-03-2023-0016
Publisher
:Emerald Publishing Limited
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