Citation
Skwarek, A. (2015), "IMAPS-CPMT 2014 Poland", Soldering & Surface Mount Technology, Vol. 27 No. 3. https://doi.org/10.1108/SSMT-05-2015-0018
Publisher
:Emerald Group Publishing Limited
IMAPS-CPMT 2014 Poland
Article Type: Guest editorial From: Soldering & Surface Mount Technology, Volume 27, Issue 3
The International Microelectronics and Packaging Society (IMAPS)-Poland Chapter was established in September 1982. In the beginning, it was the International Society for Hybrid Microelectronics (ISHM)-Poland Chapter, and from 1997, it became the IMAPS-Poland Chapter.
The IMAPS is a non-profit-making organization whose aim is to spread knowledge relating to hybrid microelectronics; a key technology in the assembly and application of semiconductors, thin film circuits and printed circuit boards (PCBs) to form practical miniaturized electronic equipment. In 2008, the IMAPS joined with the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society, bringing into formation the IMAPS-CPMT organization.
The 38th IMAPS-CPMT Poland International Conference was held in Rzeszów-Czarna at the hotel Perła Bieszczadów and took place between 21 and 24 September 2014. This event was organized by the Rzeszów University of Technology. The scope of the Conference covered “everything in electronics between the chip and the system” and it was attended by 85 participants, including 19 guests from abroad. During the Conference, 14 invited lectures and 71 posters were presented. The conference was supported by one domestic and five international journals indexed by Thomson Reuters.
In this special issue of Soldering and Surface Mount Technology, seven papers from the conference have been selected to give a good coverage of the wide range of processes and procedures associated with soldering and assembly technology.
The first two papers (by Sitek et al. and Kościelski et al.) describe the challenges encountered during package-on-package (PoP) technology implementation in Surface Mount Technology assembly. The next two papers (by Araźna et al. and Futera et al.) discuss the different aspects of inkjet printing. Stadler et al. then report their work to determine the electrical properties of modern polymer thick-film resistors over a wide range of temperatures. In the sixth paper, Sitek et al. have evaluated the reliability of solder joints made on long FR-4 and metal core PCBs using thermal cycling as their accelerated testing procedure. In the last paper, my colleagues and I (Skwarek et al.) report on the influence of assembly parameters, including the soldering technique, on thermogenerator reliability after aging.
I would like to thank all the authors for their scientific work and contributions that have led to the development and publication of this special issue of Soldering and Surface Mount Technology. I hope that it will be of interest to readers of the journal and that it will help them to find novel solutions, contribute to the creation of new ideas and initiate many varied discussions about PCBs and related interconnect technologies. I believe that this branch of science could effectively be further developed in the future.
Agata Skwarek, Guest Editor
About the guest editor
Dr Agata Skwarek was born in Krakow, Poland, in May 1979. In 2003, she graduated from the Faculty of Chemistry at the Jagiellonian University. In 2010, she defended her doctoral dissertation in technical science entitled “Analysis of tin whiskers and tin pest influencing the quality of tin-rich Pb-free solder joint” in Institute of Electron Technology, Poland. Since 2011, she is working as an Assistant Professor in Institute of Electron Technology. She has authored/co-authored over a dozen articles published in international scientific journals, three patent applications and two patents. She also participated in the development of several models and prototypes. Actually, she acts in the field of microelectronics in particular on the reliability of solder joints in the test circuits. Agata Skwarek is a member of International Microelectronics and Packaging Society (IMAPS Poland Chapter). Since 2013, she acts in this society as the IMAPS Poland Chapter Treasurer.