An investigation on mechanical random vibration fatigue damage of solder joints in electronic systems
Soldering & Surface Mount Technology
ISSN: 0954-0911
Article publication date: 11 November 2020
Issue publication date: 17 May 2021
Abstract
Purpose
The purpose of this paper is to propose a method with capability of short-time implementation.
Design/methodology/approach
This paper was directed using both experimental tests and simulations to propose a comprehensive method for lifetime estimation of the solder joints.
Findings
A new method with good agreement with experimental tests has been proposed.
Originality/value
It is confirmed that paper is original.
Keywords
Acknowledgements
National Natural Science Foundation of China under Grant Nos.51705302.
Citation
Wang, F., Zhang, F., Huang, Q. and Salmani, M. (2021), "An investigation on mechanical random vibration fatigue damage of solder joints in electronic systems", Soldering & Surface Mount Technology, Vol. 33 No. 3, pp. 170-177. https://doi.org/10.1108/SSMT-07-2020-0031
Publisher
:Emerald Publishing Limited
Copyright © 2020, Emerald Publishing Limited