Advances in pressure sensing for vapour phase soldering process monitoring

Abstract

Purpose

The purpose of the paper is to improve the control of vapour phase soldering (VPS). To enable better productivity and assembling quality, the industry needs to provide precise control and measurements during assembling. In the paper, a special monitoring method is presented for VPS to enable improved process control and oven state identification.

Design/methodology/approach

The work presents the investigation of the workspace with dynamic and gage type pressure sensors in fusion with thermocouples. Different sensors were evaluated to find an appropriate type. The relation between the temperature and the pressure was investigated, according to the setup of the oven. The effect of inserting a printed circuit board (PCB) on the pressure of the vapour inside the oven was also investigated with the pressure/power functions.

Findings

It was found that the novel gage-type sensors enable better precision than solutions seen in previous literature. The sensors are able to monitor the decreasing vapour concentration when a PCB is inserted to the workspace. It was found that there is a suggested minimum power to sustain a well-developed vapour column for soldering in saturated vapour. An inflexion point highlights this in the pressure/power function, in accordance with the temperature/power curve.

Originality/value

The research presents original works with aspects of a novel sensor fusion concept and work space monitoring for better process control and improved soldering quality.

Citation

Alaya, M.A., Geczy, A., Illes, B., Harsányi, G. and Bušek, D. (2019), "Advances in pressure sensing for vapour phase soldering process monitoring", Soldering & Surface Mount Technology, Vol. 31 No. 3, pp. 169-175. https://doi.org/10.1108/SSMT-10-2018-0038