Keywords
Citation
Rigelsford, J. (2003), "Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysi", Assembly Automation, Vol. 23 No. 4. https://doi.org/10.1108/aa.2003.03323dae.001
Publisher
:Emerald Group Publishing Limited
Copyright © 2003, MCB UP Limited
Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysi
Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysi
A. JamniaMarcel Dekker2003202 pp.ISBN 0-8247-0865-2 £119.00 (hardback)
Keywords: Electronic packaging,Thermal analysis
This book provides the basic principles required by engineers for estimating thermal and mechanical characteristics of electronic systems. It is extremely well written and presents clear and easy to understand coverage of the subjects covered.
After an introduction which discusses issues in electronics packaging and design, and technical management issues, chapter 2 addresses Basic Heat Transfer: Conduction, Convection, and Radiation. It covers the basic equations and concepts, general equations, and nondimensional groups.
Chapter 3, Conductive Cooling, discusses subjects including thermal resistance, heat spreading, junction-to-case resistance, contact interface resistance and 2D or 3D heat conduction. The following two chapters address Radiation Cooling, and Fundamentals of Convection Cooling, respectively. Subjects presented include: factors influencing radiation, cabinet surface temperature, free and forced convection, fin design, and direct and indirect flow system design.
Chapters 6 and 7 present the Basics of Shock and Vibration, and an Introduction to Finite Element Method. Stress analysis, life expectancy and thermal stresses and strains, are amongst the subjects addressed in chapter 8, Design and Analysis for Mechanically Reliable Systems.
Chapter 9 discusses Electrical Reliability, while Some Analysis Tips in Using Finite Element Methods are given in chapter 10. The final chapter of the book, Design Consideration in an Avionics Electronic Package, addresses subjects including: electrical and mechanical design specifications, operational characteristics, thermal analysis, and reliability and MTBF calculations.
The "Practical Guide to the Packaging of Electronics" is an outstanding reference text that will be of great use to professional engineers and project managers, and should be read by all students on electronic and electrical engineering courses.