Patent abstracts

Citation

(2008), "Patent abstracts", Assembly Automation, Vol. 28 No. 4. https://doi.org/10.1108/aa.2008.03328dad.005

Patent abstracts

Article Type: Patent abstracts From: Assembly Automation, Volume 28, Issue 4

Title: Low swage load fastening system and methodPatent number: WO2008054397Publication date: 8 May 2008Applicant: Huck Int Inc. (USA); Mercer Larry D. (USA); Corbett Robert J. (USA)

Abstract: A low swage load fastening system is provided for installing swage-type fasteners. The fastener includes a pin member having an elongated pin shank. An enlarged head at one end of the pin engages one side of the work pieces. A grooved pin portion extends past an opposite side of the work pieces. A collar includes a shank portion adapted to be swaged into the pin lock grooves in response to a relative axial swage load applied by an installation tool. One aspect of the system, the collar is as-headed and does not require thermal processing yet provides an optimum balance of reduced collar shank wall thickness and increased hardness, whereby the swage load is minimized. A low wage load thread form for the lock grooves of the pin is also provided, a reduced diameter, relatively short pull portion pin extension, installation tool improvements, and an associated method of use are also disclosed.

Title: Liquid resin composition, semiconductor wafer with adhesive layer, semiconductor element with adhesive layer, semiconductor package, method for manufacturing semiconductor element, and method for manufacturing semiconductor packagePatent number: WO2008053590Publication date: 8 May 2008Applicant: Sumitomo Bakelite Co. (JP); Masuda Takeshi (JP); Okubo Hikaru (JP)

Abstract: This invention provides a liquid resin composition for use in bonding of a semiconductor element onto a support. The tackiness of the liquid resin composition at 25°C upon heat treatment at 120°C for 10 min is not more than 0.05 N, and the tackiness of the liquid resin composition at 80°C is not less than 1 N. There is also provided a semiconductor wafer with an adhesive layer formed from the liquid resin composition. The present invention further provides a method for manufacturing a semiconductor element, comprising a coating step of coating an adhesive, formed of a liquid resin composition comprising a heat curable resin and a solvent, on one side of the wafer, a volatilization step of volatilizing the solvent while substantially maintaining the molecular weight of the liquid resin composition to form an adhesive layer, an applying step of applying a dicing sheet onto one side of the wafer, and a cutting step of cutting the wafer into pieces.

Title: Adhesive filmsPatent number: WO2008054637Publication date: 8 May 2008Applicant: Dow Global Technologies Inc. (USA); McGee Robert L. (USA); Hatlewick Julie R. (USA)

Abstract: This invention comprises a film useful as an adhesive, a composition useful to make the film, and a laminate comprising the film contiguous with at least one metal substrate, at least one foam substrate or combination thereof. The composition comprises: at least one anhydride grafted olefin polymer, at least one high density polyethylene, and at least one elastomer, which preferably has a tensile elongation at break of at least about 585 per cent, a density of at most about 0.900 g/cm³ or a combination thereof. The anhydride grafted olefin polymer or combination thereof is preferably present in an amount of from about 20 to about 40 weight percent, the high density polyethylene or combination thereof is preferably present in an amount of from about 40 to about 60 weight percent, and the elastomer or combination thereof is preferably present in an amount of from about 17 to about 30 weight percent. Each anhydride grafted olefin polymer is independently most preferably a maleic anhydride grafted high-density polyethylene. The high density polyethylene preferably has a melt index at most about 30 deg/min. The elastomer is preferably a substantially linear ethylene polymer or olefin block copolymer.

Title: Binding method and binding aid for assisting binderPatent number: WO2008053883Publication date: 8 May 2008Applicant: Matsushita Teruaki (JP)

Abstract: At least one of holes or grooves to which a binder of a binding aid is joined is formed as an engagement/joining hole or an engagement/joining groove having a function for longitudinally engaging with an engagement member of the binder inserted into the hole or the groove. This prevents the binder from moving relative to the binding aid. A binder or binders are engaged and joined to the engagement/joining holes or the engagement/joining grooves, and after the engaged and joined binders are passed through the engagement holes or the engagement grooves, the engagement member of each binder is engaged by an engagement mechanism of the binder itself. By this, objects to be bound are bound in a cross pattern and fastening force of the binders to the objects is increased.

Title: Memory module assembly including heat sink attached to integrated circuits by adhesivePatent number: US7365985Publication date: 29 April 2008Applicant: Super Talent Electronics Inc. (USA)

Abstract: A memory module assembly includes two-plate heat sink attached to one or more of the integrated circuits (e.g. memory devices) of a memory module PCBA by adhesive. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory devices or the heat-sink plates, and then compressed between the heat-sink plates and memory module using a fixture. The fixture is then passed through an oven to activate/cure the adhesive. The two heat sink plates are connected together to form a rigid frame.

Title: Improvements in fastenersPatent number: WO2008053176Publication date: 8 May 2008Applicant: Titus & Ltd (GB); Vallance William Ernest Taylor (GB); Svara Valter (SI)

Abstract: A camming element for a furniture jointing device is made from flat blank material, conveniently steel. The camming element is in the form of a generally cylindrical drum (10) having an aperture (13a) for receiving the head of a fastening element. On the inside of the slot, the camming element is provided with eccentric camming surfaces (15a, 15b) to engage the head of a dowel when the camming element is rotated, in use. The camming surfaces (15a, 15b) are designed to have a degree of resilient flexibility towards the end of the rotational movement of the camming element.