Thermal cycler for testing of circuit boards

Citation

(2001), "Thermal cycler for testing of circuit boards", Aircraft Engineering and Aerospace Technology, Vol. 73 No. 6. https://doi.org/10.1108/aeat.2001.12773fad.002

Thermal cycler for testing of circuit boards

Thermal cycler for testing of circuit boards

Keywords: Radstone Technology, Thermal cycling, Testing

A turbo-jet thermal cycling unit is reported to be providing convenient, compact test capabilities for Radstone Technology, a major supplier of high-performance rugged VME-based embedded computer products to the defence and aerospace industry (see Plate 1).

While large environmental chambers are used in the main production areas for batch testing, the turbo-jet is said to have proved ideal for thermal cycling of individual boards, either being repaired or being developed by the company. It is particularly useful for quickly identifying marginal, temperature or intermittent problems, according to Radstone's Product Life Cycle Management (PLM) team leader Martin Holmes, and can also be used to thermally shock products to bring out printed circuit faults.

Plate 1 The turbo-jet cycling unit from Carbolite provides convenient, compact test capabilities at Radstone Technology

The small footprint of the machine – just 53cm x 68cm – and the fact that it is easy to move has made it particularly suitable for the typically confined spaces of repair or development laboratory environments, he says. It is also easy for operators to use.

With the turbo-jet in position beside the appropriate test rack, the operator uses an articulated arm to direct temperature-controlled air at different parts of the board until faults are pinpointed. Temperatures used generally range from –40°C to +85°C. When required, the equipment can produce air from –80°C to +230°C at transition rates up to 1,600°C per minute.

Further details are available from Carbolite. Tel: +44 (0) 1433 620011; Fax: +44 (0) 1433 621198; E-mail: enquiry@carbolite.co.uk