Thermal materials technology

Aircraft Engineering and Aerospace Technology

ISSN: 0002-2667

Article publication date: 1 June 2003

94

Citation

(2003), "Thermal materials technology", Aircraft Engineering and Aerospace Technology, Vol. 75 No. 3. https://doi.org/10.1108/aeat.2003.12775cad.009

Publisher

:

Emerald Group Publishing Limited

Copyright © 2003, MCB UP Limited


Thermal materials technology

Thermal materials technology

Engineered to provide a solution for thermal management and structural problems in severe environments, the IXION range of Thermal Materials from ATEK Technology are said to combine the best properties of both metals and ceramics. Enabling the final product to be tailored to meet the multiple performance requirements including thermal expansion, weight, stiffness and thermal conductivity, without the compromises often associated with traditional material solutions; they are believed ideal for use in aerospace, avionics, and defence.

Two product types have been designed for systems requiring low to moderate thermal dissipation through direct-contact conduction cooling and systems requiring high-thermal dissipation through active air or liquid cooling.

Low to moderate thermal dissipation through direct-contact conduction cooling can be provided through power module base plates and sinks, microprocessor lids and heat spreaders, printed wiring board cores, electronic chassis and enclosures, and carriers and hybrid package bases.

High-thermal dissipation through active air or liquid cooling can be achieved via a host of components such as rugged, one-piece Al/SiC heat exchangers with internal pin or fin cooling features. Particularly suited to applications where maximum performance, design flexibility and economy are required; these components incorporate Al/SiC pins only, as opposed to moulded-in aluminium parts.

Offering thermal conductivities (TC) in the 170 region similar to aluminium, densities of 3 or less (copper is 8.9) and thermal coefficient of expansion (TCE) down to 6.4 (copper is 17), the material can, depending on the application, be supplied as finished components or base material for post processing.

Details available from: ATEK Technology Limited. Tel: +44 (0)1823 481248; Fax: +44 (0) 1823 481120.

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