Keywords
Citation
(2003), "Thermal materials bring cool solutions to hot applications", Aircraft Engineering and Aerospace Technology, Vol. 75 No. 5. https://doi.org/10.1108/aeat.2003.12775ead.001
Publisher
:Emerald Group Publishing Limited
Copyright © 2003, MCB UP Limited
Thermal materials bring cool solutions to hot applications
Thermal materials bring cool solutions to hot applications
Keywords: Thermals, Materials
Engineered to provide a solution for thermal management and structural problems in severe environments, the KION range of Thermal Materials from ATEK Technology are said to combine the best properties of both metals and ceramics. Enabling the final product to be tailored to meet the multiple performance requirements including thermal expansion, weight, stiffness and thermal conductivity, without the compromises often associated with traditional material solutions, they are believed to be ideal for use in aerospace, avionic and defence.
Two product types have been designed for systems requiring low to moderate thermal dissipation through direct-contact conduction cooling and systems requiring high-thermal dissipation through active air or liquid cooling.
Low to moderate thermal dissipation through direct-contact conduction cooling can be provided through power module base plates and sinks, microprocessor lids and heat spreaders, printed wiring board cores, electronic chassis and enclosures, and carriers and hybrid package bases.
High-thermal dissipation through active air or liquid cooling can be achieved via a host of components such as rugged, one-piece AI/SiC heat exchangers with internal pin or fin cooling features. Particularly suited to applications where maximum performance, design flexibility and economy are required, these components incorporate AI/SiC pins only, as opposed to moulded-in aluminium parts.
Offering thermal conductivities (TC) in the 170 region similar to aluminium, densities of three or less (copper is 8.9) and thermal coefficient of expansion (TCE) down to 6.4 (copper is 17), the material can, depending on the application, be supplied as finished components or base material for post processing.
Details available from: ATEK Technology Limited. Tel.: +44 (0)1823 481248; Fax: +44 (0)1823 481120.