IPC to examine what new millennium holds for PWB/EMS industries at AMRC/TMRC conference

Circuit World

ISSN: 0305-6120

Article publication date: 1 March 1999

38

Keywords

Citation

(1999), "IPC to examine what new millennium holds for PWB/EMS industries at AMRC/TMRC conference", Circuit World, Vol. 25 No. 1. https://doi.org/10.1108/cw.1999.21725aab.006

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Emerald Group Publishing Limited

Copyright © 1999, MCB UP Limited


IPC to examine what new millennium holds for PWB/EMS industries at AMRC/TMRC conference

IPC to examine what new millennium holds for PWB/EMS industries at AMRC/TMRC conference

Keywords IPC, Millennium

Members of the printed wiring board (PWB) and electronics manufacturing services (EMS) industries can find out how they will be affected by the global market in the years to come by attending IPC's Assembly Marketing Research Council (AMRC) and Technology Marketing Research Council (TMRC) Conference. The event is being held at the Sheraton Crescent Hotel in Phoenix, Arizona, 9-10 December 1998.

Industry leaders will make presentations during the AMRC/TMRC Conference to enlighten attendees on what marketing and technological trends will be shaping the industry over the next five years. Institute for Global Futures President Dr James Canton will get things started with his keynote presentation, "Leading-edge technologies for the twenty-first century".

To meet customer needs, PWB and EMS companies need to invest in the right technologies and capital equipment. To that end, Steve Anderson, vice president, corporate product marketing of Amkor, will discuss the effect of advanced component technology on the electronic interconnection industry.

TMRC attendees will hear Jan Vardaman, president of TechSearch International, discuss current and future applications of microvia boards. In addition, a panel of representatives from MicroPak Laboratories, Electro Scientific Industries Inc. and Lumonics will provide an insider's look at what tools the industry can expect from laser drill equipment in the future.

In AMRC sessions, Frost & Sullivan's Matthew Saltz will discuss the next wave of integrated circuits, and the effect on flip chip and chip-scale packaging on the ball grid array market. A panel of representatives from Siemens Energy & Automation, Universal Instruments and Company will share their thoughts about future trends in pick-and-place and component insertion equipment.

The rest of the conference focuses on industry and economic forecasts. Corporate economist Bob Shrouds, from Du Pont, will provide his annual economic outlook. Attendees will also hear the annual semiconductor forecast by Dataquest vice president Joe Grenier. Keith Dunne, managing director for BancBoston Roberts Stephens, will give Wall Street's view of the industry and explain its current financial state and the implications for the future.

As an added benefit for attendees, IPC has commissioned Henderson Ventures to provide a report detailing future end-market consumption of assemblies. Report contents will include estimated product consumption for 44 detailed end markets, as well as a five-year estimate for eight major markets.

For more information on the AMRC/TMRC Conference, contact IPC Director of Market Research: Stephanie A. Kaplan. Tel: +1 (847) 790-5317; or E-mail StephanieKaplan@ipc.org

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