Proposed EC lead ban is premature

Citation

(1999), "Proposed EC lead ban is premature", Circuit World, Vol. 25 No. 2. https://doi.org/10.1108/cw.1999.21725bab.002

Proposed EC lead ban is premature

Proposed EC lead ban is premature

Keywords Environmental regulations, EU, Lead, PCIF

The ban on lead included in the proposed EU Directive on Waste from Electrical and Electronic Equipment (WEEE) will, unless the timescale for implementation is extended and a viable alternative material identified, have the most serious of consequences for the whole electronics industry, according to the European Federation of Interconnection & Packaging (EFIP).

The Federation is urging the European Commission (EC) to extend the present implementation date of any lead ban from 2004 to at least 2009 and to instigate an independent global survey that examines all possible lead-free alternatives, measuring each against criteria that embrace technically acceptable processing temperatures, joint reliability and "reworkability". EFIP also points out that, despite claims to the contrary, there is as yet no truly viable drop-in replacement for tin-lead solder.

"Of course we fully support a ban on lead and other materials that damage the environment", said EFIP executive director, Brian Haken, "but to outlaw the use of tin-lead solder without first confirming that a truly viable alternative will be available makes no sense whatsoever."

Haken continued: "And since the proposed ban would apply not only to electronic goods manufactured in the EU, but also to those imported from the rest of the world, the impact will be global. In effect, Europe will be implementing an unofficial trade embargo on PCB assemblies containing lead from the USA, the Far East, or wherever."

Accepting that increased cost should not figure in any argument against change (the Federation cites a study that puts the European cost, excluding plant and equipment changes, of switching to lead-free solder at between $114 million and $733 million). EFIP's submission to the EC lists a raft of issues that need addressing before a ban is imposed. These include questions such as the ability of components and PCBs to withstand higher processing temperatures and the long term reliability of lead-free solder joints.

Another factor highlighted by EFIP as being particularly problematic is the need to single out, from many contenders, one lead-free alternative for world-wide adoption. Such a replacement for tin-lead solder will need to be accepted and adopted not only by PCB assemblers, but also by component manufacturers, the bare PCB fabrication industry and equipment repairers.

"We are fully behind the EC's attempts to safeguard our environment, and getting rid of lead is certainly desirable," Haken said. "But we do urge the EC to adopt an approach that gradually phases out the material rather than going for a precipitous ban that will have calamitous effects on the worldwide electronics industry."