Keywords
Citation
(1999), "Orbotech announces new direct imaging system", Circuit World, Vol. 25 No. 4. https://doi.org/10.1108/cw.1999.21725dad.001
Publisher
:Emerald Group Publishing Limited
Copyright © 1999, MCB UP Limited
Orbotech announces new direct imaging system
Orbotech announces new direct imaging system
Keywords: Orbotech, Direct imaging
Orbotech Ltd launched its new DP-100™ direct imaging system at IPC Expo in March. An enabling production technology that eliminates many steps in printed circuit board ("PCB") manufacturing.
The DP-100 was developed at Laser Imaging Systems GmbH & Co. KG ("LIS"), a joint venture established in 1996 between Orbotech Ltd and Jenoptik GmbH. Commenting on the system's release, Dr Werner Eschke, General Manager of LIS, noted: "Based on years of accumulated experience, we have developed a unique UV optical concept, boasting an excellence of electronics, mechanics and pneumatics which has enabled the development of the DP-100 as a large format, highly accurate, high speed UV direct imaging system."
Orbotech's DP-100 system is reportedly capable of exposing up to 120 layers per hour in manual operation mode, and up to 160 layers per hour in automated operation mode. With virtually no set-up time, the DP-100 system ensures that the production process continues steadily even in environments where job priorities and part numbers are changed frequently.
The DP-100 system is able to overcome many yield problems associated with even the most difficult jobs, including large format and complex applications. The system utilizes advanced digital imaging techniques, such as digital image scaling and high precision optical alignment, in order to achieve wide process latitude and precise side-to-side registration. A single scan-line is used to image the entire panel, providing uniform exposure over large panel surfaces. Fewer process steps and sophisticated, self-contained, environmental filtering mechanisms reduce handling defects and lower the risk of external contamination.
The DP-100 is fully compatible with existing industry production processes. It is capable of imaging dry and liquid UV-sensitive resists regularly used in PCB production and may be used without modification to downstream or upstream production processes, such as lamination or etching.
For further information, please contact Brewster F. Barclay, Director of Marketing, Orbotech S.A. Tel: +32 2 727 48 11; Fax: +32 2 727 48 48.