Keywords
Citation
(2001), "BPA to investigate optical backplanes", Circuit World, Vol. 27 No. 2. https://doi.org/10.1108/cw.2001.21727bab.008
Publisher
:Emerald Group Publishing Limited
Copyright © 2001, MCB UP Limited
BPA to investigate optical backplanes
BPA to investigate optical backplanes
Keywords: BPA, Interconnection
As system performance pushes data rates up, designers are beginning to realise the opportunities provided by optical interconnect inside the system. Optical signals offer very high bandwidth with no signal degradation from cross-talk or other interference. The backplane provides the opportunity for interconnect in fibre or wave guide – an exciting and valuable challenge for the PCB manufacturer.
Technologies are already being explored for the optical backplane. OEMs are developing new technologies and looking for manufacturers to turn prototypes into production. PCB manufacturers can exploit this high added value niche market but need to make the correct choices of timing and technology.
BPA have identified the backplane as an interesting focus for the interaction of optical, copper and wireless interconnect. They are proposing a multi-client programme in the area. Parties subscribing will define the final research programme but initially BPA will be setting out the address:
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When will optical backplane be required?
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Which system applications will they be used in?
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What are the most likely technologies that will be used to create optical backplanes?
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What will the global market demand be for optical backplanes?
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Where and what are the market opportunities in the supply chain for optical backplanes?
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How will optical backplanes impact the existing electrical backplane and PCB industries?
For more information on the forthcoming optical backplanes study, please contact Sarah Demmon, Marketing Manager on +44 (0) 1306 875500 or e-mail on s.demmon@bpaconsulting.com