Keywords
Citation
(2001), "Labtech trebles plating capacity", Circuit World, Vol. 27 No. 2. https://doi.org/10.1108/cw.2001.21727bab.013
Publisher
:Emerald Group Publishing Limited
Copyright © 2001, MCB UP Limited
Labtech trebles plating capacity
Labtech trebles plating capacity
Keywords: Labtech, Plating
Labtech has announced that it is trebling its plating capacity.
The company has recently installed a new electrolytic nickel and hard and soft gold line, a new fully automatic electroless nickel gold line and a new hot air solder levelling process. They have also renewed their resist-strip chemical etch line to a higher specification. A new electrolytic plating line from PAL and a new oxide coating line have been in use since the end of September 2000.
This investment, totalling £750,000, completes Labtech's major capital expenditure programme in the chemical processing area and is the end of a two-year programme to provide a higher technical tolerance capability with automated SPC production.
Bob Lowther, Labtech's sales and marketing director, comments "Labtech is experiencing a major growth in demand for microwave circuits, arising from sustained, strong growth in the wireless communications market. The emergence of wireless broadband data access networks and third generation cellular telephony will drive demand for our advanced microwave circuits to even higher levels. This investment programme will enable Labtech to meet current and future customer requirements."