IPC honors members at Printed Circuits Expo for outstanding contributions

Citation

(2001), "IPC honors members at Printed Circuits Expo for outstanding contributions", Circuit World, Vol. 27 No. 4. https://doi.org/10.1108/cw.2001.21727dab.004

IPC honors members at Printed Circuits Expo for outstanding contributions

IPC honors members at Printed Circuits Expo for outstanding contributions

Keyword: IPC

IPC honored 15 members at IPC Printed Circuits Expo in Anaheim, California, for their contributions to IPC and the electronics industry.

Six individuals were honored with the IPC President's Award. This award is given to members who have exhibited ongoing leadership in IPC and have made significant contributions to the association and the electronics interconnect industry. This award can only be bestowed on an individual once. President's Award recipients honored at IPC Printed Circuits Expo were:

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  Linda Self, Litton Interconnect Technologies, for significant contributions to both the TMRC Steering Committee and the strategic planning committee.

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  Jerry Bouska, Isola Laminate Systems Corporation, for his leadership of the TMRC Strategic Planning Committee, the PWB World Market Statistical Committee and the Laminators Committee.

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  Rick Steiner, Gould Electronics, for his work on the TMRC Steering Committee, as well as his contributions to the Strategic Planning Committee and the Steering Committee Membership Committee.

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  Mark Bird, Amkor Technology Inc., for his work as a member of the IPC Technology Committee.

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  Greg Munie, Lucent Technologies Inc., for his work on the 2000/2001 Electronic Interconnection Technology Roadmap and the IPC Technology Committee Executive Board.

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  David Martin, Intel Corporation, for his contribution on the GenCam API.

IPC also presented seven Distinguished Committee Service Awards at IPC Printed Circuits Expo 2001. This award is given to IPC committee members who have made an exceptional contribution to a specific standard, guideline, round robin test program or other IPC programs. The following two members were recognized for their work in responding to Environmental Protection Agency's (EPA) proposed MP&M effluent guideline rule:

1. 1.

   John Sharp, Teradyne Connection Systems.

2. 2.

   Bret Bruhn, Tyco.

For their individual work on various programs, five additional members were honored with Distinguished Committee Service Awards:

1. 1.

   Michael Jouppi, MRJouppi and Associates, for updating and expanding the popular current carrying capacity charts for IPC-2221, generic standard on printed board design.

2. 2.

   Nick Paulter, National Institute of Standards and Technology (NIST), for his contributions toward the revision of IPC-2552, design guide for RF/microwave circuit boards.

3. 3.

   Michael Hill, Viasystems, for his work on IPC-9252, guidelines and requirements for electrical testing of unpopulated printed boards.

4. 4.

   Ignatius Chong, Celestica International Inc., for his work on IPC-SM-782A, surface mount design and land pattern standard.

5. 5.

   Thomas Guthrie, Barco Gerber Systems, for his contributions on IPC-ET-652, guidelines and requirements for electrical testing of unpopulated printed boards and revised version IPC-9252.

IPC also presented two special recognition awards at IPC Printed Circuits Expo. These awards are presented to individuals who have made a recent exceptional contribution to an IPC program. The following were honored for their work on developing the IPC-2251, design guide for electronic packaging utilizing high-speed equipment, which replaces the popular IPC-D-317A:

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  Byron Case, L-3 Communications.

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  Ross Wellington, L-3 Communications.