ESI introduces new dual head laser microvia drilling platform enabling improved performance and accuracy

Citation

(2001), "ESI introduces new dual head laser microvia drilling platform enabling improved performance and accuracy", Circuit World, Vol. 27 No. 4. https://doi.org/10.1108/cw.2001.21727dad.006

ESI introduces new dual head laser microvia drilling platform enabling improved performance and accuracy

ESI introduces new dual head laser microvia drilling platform enabling improved performance and accuracy

Keywords: Microvias, Lasers

Electro Scientific Industries, Inc. introduced its dual head microvia drilling platform targeted at the high density interconnect (HDI) and packaging markets at the IPC Printed Circuit Expo.

The Model 5400 dual head laser microvia drilling platform incorporates ESI's patented compound beam positioner. The fluid motion of the beam positioner stage provides customers with greater throughput and accuracy, increasing productivity over conventional step and repeat methods.

"This new platform, with its dual head configuration, increases productivity by at least 60 percent and expands ESI's array of drilling solutions for our customers", said Tom Richardson, general manager for ESI's advanced packaging products. "The 5400 series offers flexibility and cost-effective drilling solutions and provides a platform for future technology upgrades."

The dual head platform allows ESI to configure the system specifically for the application. A UV laser, for example, may be used to punch blind vias in IC packaging substrates, while a second dual head CO² drill could be used on fiber reinforced materials for cell phone applications. In addition, the platform is field extensible to allow for future upgrades of new laser or optic technologies, protecting the customers' capital investment.

While the dual head technology has been available in a step-and-repeat format, ESI's patented compound beam positioner gives users the innovative capability to move each of the drills independently in a linear, fluid, high-speed motion along both a X and Y axis, eliminating many sources of errors found in most two-stage designs. Because via spacing is generally small, the galvanometer field can be small and very accurate. Distortions found in larger galvanometer systems are not a factor in this design, nor are "patchwork" or "abutment" errors that may arise by piecing together smaller fields over a large area.

For further information, contact: Electro Scientific Industries, Inc., 13900 N.W. Science Park Drive, Portland, Oregon 97229-5497, USA. Tel: (503) 641-4141;Fax: (503) 643-4873.