New board of directors elected for EIPC

Citation

(2002), "New board of directors elected for EIPC", Circuit World, Vol. 28 No. 2. https://doi.org/10.1108/cw.2002.21728bab.001

New board of directors elected for EIPC

New board of directors elected for EIPC

EIPC has announced the election of their new Board of Directors and unveiled an extensive program of activities on behalf of the European P&I industry last Wednesday.

At their General Assembly, held at the electronic industry show Productronica in Munich on November 7th, the membership elected a new Board of Directors representing the many nationalities and branches of the P/I industry which make up the EIPC. Although the Board wished him to continue in his leadership role, William Burr, Technical Director of Lares Cozzi in Italy, decided to step down as Chairman of the EIPC. Bill has been serving on the Institute, both as a board member and as their Chairman for many years.

Under his direction, the Institute successfully transitioned from a primarily technical role based in Switzerland to a broader representation of Europe's P&I industry with links to other industry associations worldwide. This expansion has made possible a complete restructuring of the Institute, foundation of an affiliated services company, and relocation to within the EU under professional management.

“The EIPC has a major asset: the quality of our Board of Directors. Because the Institute is made up of individual companies, we have senior people from the industry who know the business and can marshal the resources the Institute needs to move ahead” said Mr. Burr. “From my point of view the membership has once again returned a first class team to the Institute and I am honoured to have worked with many of them for these past years.”

The new Board accurately reflects the role of the Institute throughout the logistics chain of Europe's electronic packaging and interconnection industry as well as the various nationalities of the membership. Suppliers, subcontractors, substrate manufacturers, end users, and electronic manufacturing service companies are represented under the Chairmanship of Mr. Paul Waldner, Managing Director of Multiline Europa GmbH. Paul Waldner's nomination and election as chairman reflects the members' appreciation for serving the institute for many years, his contributions to the Industry and to the continuity of the Institute.

The following individuals were elected by the membership:Wil Kregting, Viasystems, Netherlands (Vice Chairman)Brewster Barclay, Orbotech, Belgium (Vice Chairman)Michael Weinhold, Dupont, Switzerland (Treasurer)Umberto Aiassa, ACD Technologies, ItalyMartin Goosey, Shipley, United KingdomDidier Mauve, Deglarges, FranceFabio Pelizzoli, Cabel, ItalyAndreas Steinkogler, Microser, Spain