Citation
(2002), "New “non-puddling” etching technology", Circuit World, Vol. 28 No. 2. https://doi.org/10.1108/cw.2002.21728bad.003
Publisher
:Emerald Group Publishing Limited
Copyright © 2002, MCB UP Limited
New “non-puddling” etching technology
New “non-puddling” etching technology
PILL e.K. of Auenwald, Germany, in alliance with ECI Technology have introduced a new “non- puddling” etching technology for PCB production in the North American market. While all other manufacturers try to minimize puddling, this new technology eliminates it from upper PCB surfaces completely. The “Vacu Etch” module simultaneously sprays and extracts the etching solution allowing it to etch the board surface while preventing it from settling at the board's center.
Plate 1
Test results have shown thickness variations of ±1 micron over an area of 650 x 650mm on both surfaces of PCBs tested with an under cut of only 2 microns for conductors <50 microns wide and 18 microns thick. These superior results indicate a true alternative to the “corrective” etching procedures currently used by PCB manufacturers.
The partnership provides complete sales, technical support and installation services. Maintaining inventory and engineering services in ECI's facility in NJ as well as sales offices throughout North America.