Citation
(2002), "DuPont i Technologies Announces Pyralux® TM for Fine Line Circuitry", Circuit World, Vol. 28 No. 2. https://doi.org/10.1108/cw.2002.21728bad.004
Publisher
:Emerald Group Publishing Limited
Copyright © 2002, MCB UP Limited
DuPont i Technologies Announces Pyralux® TM for Fine Line Circuitry
DuPont i Technologies Announces Pyralux® TM for Fine Line Circuitry
DuPont i Technologies introduces a new Pyralux® laminate for use in flexible circuits requiring fine line traces. The new all-polyimide adhesiveless-clad, called Pyralux® TM can be used in such applications as display, high-density disk drive and ink jet printer circuits.
The new single- or double-sided copper-clad laminate is an all-polyimide composite of DuPonte™ Kapton® film metalized by sputter deposition of tiecoat metal and copper. TM is available in standard electroplated copper thicknesses of 5, 9 and 12 µms and KaptonE film thicknesses of 25 and 50 µms with either a nickel copper (monel) or chrome tiecoat. Microvias can be readily formed in Pyralux® TM laminates because of the excellent laser processing and chemical etching characteristics of the Kapton® E films.