Keywords
Citation
(2002), "New direct current acid copper system", Circuit World, Vol. 28 No. 3. https://doi.org/10.1108/cw.2002.21728cad.005
Publisher
:Emerald Group Publishing Limited
Copyright © 2002, MCB UP Limited
New direct current acid copper system
New direct current acid copper system
Keywords: Copper, Enthone Inc
Enthone Inc.has introduced CUPROSTAR ST–2000, a direct current acid copper system. The system combines high current density capability with exceptional thermal cycle properties, surface distribution and throwing power to meet high aspect ratio through–hole and microvia PWB designs. Significant improvements in plating speed and deposit uniformity are achieved versus conventional direct current systems. The system provides results similar to pulse periodic reverse plating systems.
The superior physical properties of the CUPROSTAR ST–2000 system make it ideally suited for improved plated through–hole reliability, especially in the “lead–free” assembly soldering environment. Unique features and benefits include:
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High Current Density Capability/Excellent Throwing Power: Operates at high current densities (30–50 ASF) with good distribution both across the panel and panel surface to hole (throwing power).
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Exceptional Physical Properties: Excellent elongation and a low level of organics in the deposit result in superior thermal cycle performance.
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Eliminates Equipment Costs: CUPROSTAR ST–2000 uses direct current, eliminating the capital investments required for PPR rectification.
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Lower Operating Cost: Low brightener consumption (0.1–0.2 ml/Ahr) compared to most commercially available DC or PPR coppers.