Glass fibre for printed circuit boards

Circuit World

ISSN: 0305-6120

Article publication date: 1 December 2002

51

Keywords

Citation

(2002), "Glass fibre for printed circuit boards", Circuit World, Vol. 28 No. 4. https://doi.org/10.1108/cw.2002.21728dad.008

Publisher

:

Emerald Group Publishing Limited

Copyright © 2002, MCB UP Limited


Glass fibre for printed circuit boards

Keywords: Printed circuit boards

The Japanese companies Nitto Boseki and Nitto Glass Fibre Manufacturing have developed a glass fibre with a low dielectric constant and tangent, which they say is suitable for use in stabilizing and reinforcing high-density printed circuit boards (PCBs).

Specific applications are found in PCBs used in communications equipment for satellite broadcasting and mobile telephones. This is an area that is demanding faster signal processing, requiring denser circuitry design.

The glass fibre developed by the companies is said to be water-resistant and to have a low thermal expansion. This latter property confers faster signal processing speed and higher component density to the composite circuit panels. The material is also easier to work, which in turn reduces manufacturing costs.

For further information, contact: Nitto Boseki Co Ltd, 2-1

Nihonbashi-Hamacho, 1-chome, Chuo-ku, Tokyo 103-8489, Japan;Tel: +81-3-3865-6728; Fax: +81-3-3865-6725.

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