Keywords
Citation
(2005), "NPL seeks partners for new reliability project for lead-free processed substrates", Circuit World, Vol. 31 No. 3. https://doi.org/10.1108/cw.2005.21731cab.007
Publisher
:Emerald Group Publishing Limited
Copyright © 2005, Emerald Group Publishing Limited
NPL seeks partners for new reliability project for lead-free processed substrates
NPL seeks partners for new reliability project for lead-free processed substrates
Keywords: Substrates, Printed circuits
National Physical Laboratory will shortly start a new studio project and welcomes interest from potential partners, especially manufacturers with high reliability concerns, printed circuit board and laminate suppliers.
The aim of this project is to investigate the reliability of existing substrates manufactured using a lead- free process. This project will include investigation of the reliability of microvias, non-functional pads and the design/build aspects of the substrate. The project will also investigate these substrates in terms of conductive anodic filamentation (CAF) susceptibility.
Following lead-free processing circuit boards will be stressed using both thermal cycling and an electrical test method. The electrical test method is an interconnect stress test (IST) that is fast, environmentally friendly and includes automatic data-logging.
The test vehicle design will comprise a number of features that will also include board supplier properties. NPL (with the partners) will design a test vehicle and carry out reliability tests to come up with a new test method for assessing circuit boards with a lead-free profile.
The time frame is to launch this project within 3 months and complete within 9-12 months.
Potential partners from those companies with high reliability concerns, board and laminate suppliers should contact: Dr Chris Hunt. E-mail: chris.hunt@npl.co.uk