The cementation rate of copper‐steel system in the presence of different solvents

Abstract

Measures the rates of the copper (II)/steel cementation reaction in organic‐water mixture solvent at 25°C using an atomic absorption spectrophotometer. The relation between In C0/C and t in the absence of non‐aqueous solvent and at very diluted CuSO4 solution is given by In C0/C= k.A.t/V, while in the organic‐water mixture the data fit the equation of In C0lC= b+kAt/V. Finds that the rate constant of the cementation reaction increases with increasing the dielectric constant of the mixture. The rate of cementation increased in the order: water > methanol > ethanol > n‐propanol > 2‐propanol.

Citation

El‐Batouti, M. (1996), "The cementation rate of copper‐steel system in the presence of different solvents", Anti-Corrosion Methods and Materials, Vol. 43 No. 2, pp. 20-24. https://doi.org/10.1108/eb007389