METHODS

Abstract

Pulse plating gives improved copper distribution for PCB's. JCT Controls report that application of their latest PDM pulse plating controller in electroplating acid copper on printed circuit boards with 11:1 aspect ratio holes has given substantial benefits in plating performance.

Citation

(1988), "METHODS", Anti-Corrosion Methods and Materials, Vol. 35 No. 2, pp. 15-17. https://doi.org/10.1108/eb020631