The Library Shelf

Abstract

The author has prepared this book with the object of aiding the engineer or technician confronted with the problem of joining two metals, by helping him to choose the correct type of adhesive, use it and design an adhesive joint for optimum performance. The author succeeds admirably in this aim and in addition has included valuable information concerning new types of American adhesives, some of which have been developed specially for missiles and which are not widely known. He is a research engineer at North American Aviation Inc., Downey, California and among other things is responsible for the new NAA Hi‐Temp phenolic‐resin‐base adhesive which is suitable for structural applications at temperatures up to 600 deg. F. and which is, however, cured at a temperature of only 275 deg. F. for a 1 to 1½ hour period.

Citation

(1955), "The Library Shelf", Aircraft Engineering and Aerospace Technology, Vol. 27 No. 4, pp. 135-135. https://doi.org/10.1108/eb032546