SMD Soldering — Direction and Time of Heating

Abstract

In many cases people talk about reflow soldering and do not mention the parameters. It is therefore difficult to judge results. The old struggle persists between vapour phase reflow and infra‐red reflow, made even more complicated by other techniques such as conductive heating.

Citation

Briken, H. (1989), "SMD Soldering — Direction and Time of Heating", Soldering & Surface Mount Technology, Vol. 1 No. 3, pp. 58-59. https://doi.org/10.1108/eb037693