Empirical Modelling of Surface Mount Solder Joints from 132 Pin Quad Flat Pack Components

Abstract

Tensile pull strength tests were used to study the strength of solder joints of 25 mil gull wing leads on 132 pin quad flat pack components. The authors generated quadratic and linear models which can be used to predict the pull strength of a solder joint given its geometry. The shape parameters studied were stand‐off height between the lead and substrate, height of heel fillet, radius of curvature of heel fillet, length of heel fillet, height of solder at toe region, and thickness of solder on the lead. The most significant parameters in determining the tensile pull strength of the solder joint are the height and length of the heel fillet. A study was performed to quantify the effect of lead finish on the accuracy of these models. The lead finish was found to have a significant effect on the solder joint strength. The effect of lateral misregistration on the tensile pull strength of solder joints was also investigated. No correlation between the extent of lateral misregistration and joint pull strength has been found.

Citation

Brady, N. and Ennis, T.J. (1992), "Empirical Modelling of Surface Mount Solder Joints from 132 Pin Quad Flat Pack Components", Soldering & Surface Mount Technology, Vol. 4 No. 1, pp. 4-8. https://doi.org/10.1108/eb037772