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Industrial Qualification of a No‐clean Solder Cream

A. Mantrant‐Le Bot (Bull, Angers, France)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 February 1993

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Abstract

No‐clean is an attractive alternative for eliminating CFC consumption. For high complexity and reliability boards, a very low residue solder cream, free of halides, should be chosen. Only three of the pre‐selected solder creams passed both the chemical analyses and the preliminary tests, conducted to check compatibility with Bull's current processes. Then, a specific test board with 28 interdigitated QFPs was designed for reliability and ongoing tests. After several weeks in production, Ecorel AP44 solder cream, manufactured by Promosol, was qualified.

Citation

Mantrant‐Le Bot, A. (1993), "Industrial Qualification of a No‐clean Solder Cream", Soldering & Surface Mount Technology, Vol. 5 No. 2, pp. 30-32. https://doi.org/10.1108/eb037825

Publisher

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MCB UP Ltd

Copyright © 1993, MCB UP Limited

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