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SMT/ASIC/Hybrid 1993

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 March 1993

21

Abstract

In its seventh year, SMT/ASIC/Hybrid 1993 continued its popularity and, despite the uncertain state of the west European economy, this year's event in Nuremberg attracted more visitors than before, with the number of direct exhibitors also growing by 20%. The exhibition appeared to withstand successfully the present economic recession facing the electronics industry as well as its end‐user sectors. No other European show offers the same complete spectrum of information in the microelectronics areas of surface mount technology (SMT), application specific integrated circuits (ASICs) and hybrid circuits. Not only is industry satisfaction manifested by the continually growing numbers of exhibitors and visitors, but also by the appreciation of the event expressed by representatives of both of these categories. The combination of the exhibition's quality and the visitors' competence provides excellent conditions for exhibitors to contact a large number of potential customers from Germany and the rest of Europe, as well as further afield.

Citation

(1993), "SMT/ASIC/Hybrid 1993", Soldering & Surface Mount Technology, Vol. 5 No. 3, pp. 60-60. https://doi.org/10.1108/eb037843

Publisher

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MCB UP Ltd

Copyright © 1993, MCB UP Limited

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