The Influence of Flux Residues on the Quality of Electronic Assemblies

Abstract

Ionic contaminations, especially flux residues due to manufacturing, cause various faults and failures of printed circuits during service. The contamination (µg‐eq NaCI), surface insulation resistance (SIR), electromigration and corrosion caused by flux residues of six different fluxes (categories: F‐SW26, F‐SW32 and F‐SW34 according to DIN 8511) have been investigated. The main effort was applied to the investigation of electromigration, which is understood as the formation of short circuits by metallic bridges between two conductors of different voltage.

Citation

Schmitt‐Thomas, K.G. and Schmidt, C. (1994), "The Influence of Flux Residues on the Quality of Electronic Assemblies", Soldering & Surface Mount Technology, Vol. 6 No. 3, pp. 4-7. https://doi.org/10.1108/eb037872