Development of a Novel No‐clean Low Residue Solder Paste for Fine Pitch Applications
A. Beikmohamadi
(Du Pont Electronic Materials, Research Triangle Park, North Carolina, USA)
18
Abstract
An experiment was conducted to examine the effect of post‐reflow no‐clean solder paste residue on near‐end and far‐end signal crosstalk due to changes in dielectric constant and leakage resistance in the circuit environment. Additionally, the effect of different frequency levels on post‐reflow residue was examined. Data from these studies are presented in this paper.
Citation
Beikmohamadi, A. (1994), "Development of a Novel No‐clean Low Residue Solder Paste for Fine Pitch Applications", Soldering & Surface Mount Technology, Vol. 6 No. 3, pp. 12-14. https://doi.org/10.1108/eb037874
Publisher
:MCB UP Ltd
Copyright © 1994, MCB UP Limited