Reliability of Electronics in Harsh Environments
B. Brox
(IVF — The Swedish Institute of Production Engineering Research, Stockholm, Sweden)
P.‐E. Tegehall
(IVF — The Swedish Institute of Production Engineering Research, Stockholm, Sweden)
72
Abstract
This paper reports experiences gained in several research programmes, showing the necessity to develop improved environmental tests that better accelerate the mechanisms that degrade electronics. The tests specified in standards today do not consider relevant failure mechanisms. The paper describes the authors' philosophy for performing reliability testing. Examples of various reliability tests are given.
Citation
Brox, B. and Tegehall, P.‐. (1995), "Reliability of Electronics in Harsh Environments", Soldering & Surface Mount Technology, Vol. 7 No. 3, pp. 13-16. https://doi.org/10.1108/eb037906
Publisher
:MCB UP Ltd
Copyright © 1995, MCB UP Limited