Overcoming Thermal Problems in Multilayer Printed Circuit Boards
A.J. Dane
(GEC Avionics Ltd, Rochester, Kent, England)
40
Abstract
This paper will attempt to highlight significant problems of a thermal nature, encountered during 17 years' extensive use of multilayer printed circuit boards in high technology Avionics Systems, together with recommended corrective actions.
Citation
Dane, A.J. (1985), "Overcoming Thermal Problems in Multilayer Printed Circuit Boards", Circuit World, Vol. 11 No. 4, pp. 40-42. https://doi.org/10.1108/eb043766
Publisher
:MCB UP Ltd
Copyright © 1985, MCB UP Limited