Packages for High‐density Surface‐mount Applications
G.F. Love
(Martin Marietta Orlando Aerospace, Orlando, Florida, USA)
28
Abstract
This paper addresses the various types of surface mounted packages used today for high‐density packaging of Very Large Scale Integrated devices. The paper discusses the pros and cons of both the leaded and leadless package, and provides the reader with general guidelines for their use.
Citation
Love, G.F. (1987), "Packages for High‐density Surface‐mount Applications", Circuit World, Vol. 13 No. 3, pp. 36-39. https://doi.org/10.1108/eb043881
Publisher
:MCB UP Ltd
Copyright © 1987, MCB UP Limited