Application of Electrochemical Principles to Acid Copper Plating

Abstract

Plating productivity is often limited by the deposition rate of the electrolytic copper system. Using electrochemical engineering principles, a high speed copper process has been developed which addresses this need. This paper describes the new high speed system and illustrates how the same electrochemical fundamentals can be applied to high aspect ratio‐high throw requirements.

Citation

Birdsall, P.W. (1987), "Application of Electrochemical Principles to Acid Copper Plating", Circuit World, Vol. 13 No. 4, pp. 33-36. https://doi.org/10.1108/eb043905