Flip Chip Rework Process

Abstract

This paper discusses chip removal and replacement processes of flip chip assemblies (FCAs) on printed wiring boards (PWBs). The original chip connection is achieved via mass reflow as in a surface mount assembly process. The FCA interconnection is one involving a surrogate solder bump on a chip and a lower melt solder on the PWB pads that fuses with the bump during reflow. The chip removal process thus entails melting the lower melt solder locally using hot gas. The following considerations will be discussed in the paper: chip size, chip removal methodology, local vs mass reflow for replacement attachment, solder height, the impact of multiple reflows on the solder joint integrity of assemblies. The use of the flip chip rework machine to remove ball grid arrays (BGAs) and quad flatpacks (QFPs) will be briefly addressed.

Citation

Vasan, S.V., Truong, P.T. and Dody, G. (1995), "Flip Chip Rework Process", Circuit World, Vol. 21 No. 3, pp. 16-24. https://doi.org/10.1108/eb044032