Gate Array Packaging—The Forgotten Problem

Abstract

As semi‐custom devices increase in complexity, much time is being devoted to solving the problems of automating their design. The associated problems of packaging are being overlooked. The increasing pin count is becoming a major problem. Surface mount components and hybrid circuits are proposed as a solution.

Citation

Silver, N. (1983), "Gate Array Packaging—The Forgotten Problem", Microelectronics International, Vol. 1 No. 2, pp. 35-36. https://doi.org/10.1108/eb044131