Materials and Processes for Reliable Soldering of Chip Components

Abstract

This paper outlines some general aspects of materials and processes for reliable soldering of chip components and presents some new results on testing of wettability and leaching of thick films, thermal fatigue of solders and the reliability of solder joints on different thick film metallisations.

Citation

Leibfried, W. (1984), "Materials and Processes for Reliable Soldering of Chip Components", Microelectronics International, Vol. 1 No. 4, pp. 19-25. https://doi.org/10.1108/eb044140