To read this content please select one of the options below:

Philosophy of Thick Film Materials Development

M.S. Setty (Physical Chemistry Division, National Chemical Laboratory, Pune, India)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 February 1986

45

Abstract

Thick film technology is increasingly used in hybrid microelectronic circuits throughout the world. It is entering areas of electronics hitherto dominated by other technologies. Materials are the most important parameter in any technological development. A single material can generate several technologies (e.g., silicon). The role of a Materials Scientist, particularly in the case of Thick Film Materials, has to be very comprehensive. A ‘Vertical Integration System’ is followed in the study and development of thick film materials. This has helped in understanding the complex reactions taking place and in rectifying the defects formed during thick film processing. It has been amply rewarded during the development of several conducting and resistive materials and while carrying out the basic studies of other materials as thick films. Some future trends in this area have been suggested for adapting this fascinating thick film technology.

Citation

Setty, M.S. (1986), "Philosophy of Thick Film Materials Development", Microelectronics International, Vol. 3 No. 2, pp. 72-75. https://doi.org/10.1108/eb044232

Publisher

:

MCB UP Ltd

Copyright © 1986, MCB UP Limited

Related articles