New products

Abstract

A new microcomputer‐controlled wire bond pull tester, designed to enable manufacturers of hybrid microcircuits to perform fully automatic non‐destructive pull testing of wire connections, has been introduced by Hughes Aircraft Company's industrial products division.

Citation

(1989), "New products", Microelectronics International, Vol. 6 No. 1, pp. 90-92. https://doi.org/10.1108/eb044363