Ageing, Solder Thickness and Solder Alloy Effects on Circuit Board Solderability
J.K. Hagge
(Rockwell International, Cedar Rapids, Iowa, USA)
G.J. Davis
(Rockwell International, Cedar Rapids, Iowa, USA)
59
Abstract
The paper presents the results of extensive studies on circuit board solderability comparing wetting balance and IPC test methods through performance in vapour phase and wave soldering operations. The effects on solderability of key parameters are examined and compared with storage times of one year, and accelerated ageing using damp heat, dry heat and steam oxygen. An evaluation is made of tin‐lead alloys from 40/60 to 70/30 in solder coating thicknesses from 0·1 to 1·0 mil.
Citation
Hagge, J.K. and Davis, G.J. (1985), "Ageing, Solder Thickness and Solder Alloy Effects on Circuit Board Solderability", Circuit World, Vol. 11 No. 3, pp. 8-15. https://doi.org/10.1108/eb045997
Publisher
:MCB UP Ltd
Copyright © 1985, MCB UP Limited