Solderability and Surface Mounting

Abstract

In the last decade through‐hole mounting to printed wiring boards has matured and people now have the tools to diagnose and correct any solderability problems which might arise. Such is not the case with surface mount soldering technology. In surface mount the connections are smaller and are often hidden from view. Therefore when a solderability problem does occur it may never be known until the assembly fails. The solution to the situation is to understand the nature of the problems and provide assurance that they will not occur during assembly soldering. This paper is structured in two parts. The first details the types of solderability problems unique to surface mounting. Examples of these problems will be shown and discussed with reference to solder joint life. The second part of the paper discusses the solderability testing of surface mount devices and printed wiring boards intended for surface mounting. This discussion will concentrate on the new quantitative solderability test methods being developed in this company's laboratory for leadless devices and printed wiring boards. As part of this development, new solderability criteria have been defined which reflect the unique problems associated with surface mounting.

Citation

DeVore, J.A. (1988), "Solderability and Surface Mounting", Circuit World, Vol. 14 No. 4, pp. 37-41. https://doi.org/10.1108/eb046037